3D-Molded Interconnect Device Technical Review
Mechanical and electrical engineers learn about the Laser Direct Structuring (LDS) process to integrate circuitry and electrical components into the three-dimensional space of injection molded enclosures and components. Eliminate circuit boards, wires and interconnects to reduce BOM, costs and assembly times.
- Presenting
- Jim Liddle, Dir. Business Development
- Channel
- Profitable Business Knowledge and Solutions
- Date
- Jul 15 2010
- Duration
- 981
- Tags
- LDS, 3D-MID, laser, direct, structuring
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