Optimizing vRAN with Intel® FPGA Platform

Logo
Presented by

Nadav Yafe, VP Product and Product Marketing and Oren Benisty, VP Sales, Silicom

About this talk

* Click on the video to see attachments pertaining to this webinar | This webinar will describe the architectural elements, design criteria, technology choices and key chipset employed to build a full layer 1 offload Intel® SmartNIC for a DU in a 4G/5G RAN rollout for any market. With the O-RAN Alliance’s drive to move towards an open ecosystem and interoperable building blocks, Silicom has created an O-RAN standards-compliant Layer 1 High PHY solution over an open, fully programmable platform based on Intel® FPGA, and implemented it as a PCIe add-in card. This webinar aims to demonstrate a design example of this advanced integration and the benefits it can bring to network infrastructure solutions providers. Presenters: - Nadav Yafe, VP Product and Product Marketing, Silicom - Oren Benisty, VP Sales, Silicom
Related topics:

More from this channel

Upcoming talks (1)
On-demand talks (418)
Subscribers (35165)
Intel® Industry Solution Builders program has a mission to help communication service providers and enterprises accelerate their development and implementation time by gathering a global ecosystem to provide flexible, scalable, virtualized, and cloud native solutions for cloud, core, and edge computing. The Intel® Industry Solution Builders Builders webinar program is a recurring webcast series in which ecosystem members and Intel technology experts delve into the technologies, topics, and issues facing the edge and networking industry. Ecosystem partners with commercialized solutions based on Intel architecture benefit from an array of marketing opportunities to amplify their offerings into market and accelerate adoption.