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Building the Broadband Access Edge with Radisys and Intel

Presented by

Prakash Siva, SVP and Head of Technology and Architecture at Radisys and Kevin Cackovic from Intel PSG

About this talk

This webinar will discuss Radisys products and solutions for the multi-access edge, supporting both broadband connectivity and inferencing. We will describe RAN and wireline architectures that use Intel products including 3rd Gen and 4th Gen Intel® Xeon® Scalable Processors, Intel Agilex® FPGA and SoC FPGA family. We will focus on a range of use cases around public/private, neutral host and CBRS networks. During this webinar, we will also reference our deep strategic partnership with Intel for hardware, software, and related technologies like FlexRAN™ Reference Architecture for Wireless Access, Data Plane Development Kit (DPDK) and Intel® Distribution of OpenVINO™ Toolkit. Presenters: - Prakash Siva, SVP and Head of Technology and Architecture at Radisys - Kevin Cackovic, Intel PSG
Intel® Industry Solution Builders

Intel® Industry Solution Builders

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Intel Industry Solution Builders Ecosystem Webinar
Intel® Industry Solution Builders program has a mission to help communication service providers and enterprises accelerate their development and implementation time by gathering a global ecosystem to provide flexible, scalable, virtualized, and cloud native solutions for cloud, core, and edge computing. The Intel® Industry Solution Builders Builders webinar program is a recurring webcast series in which ecosystem members and Intel technology experts delve into the technologies, topics, and issues facing the edge and networking industry. Ecosystem partners with commercialized solutions based on Intel architecture benefit from an array of marketing opportunities to amplify their offerings into market and accelerate adoption.
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