The Evolution of Higher Speed and Density in Rugged Electronic Packaging

Presented by

Mark C. Benton, TE Connectivity; Michael Walmsley, TE Connectivity; Matthew R. McAlonis, TE Connectivity

About this talk

Copper and optical interconnect technologies play a significant role in next generation rugged embedded computing, with the drive toward higher speeds and smaller form factors. Join our panel of industry-recognized experts who will discuss the levels of electronic packaging – from chips to external cabling, how copper interconnect solutions are evolving, and where optics technology breaks through to address emerging needs.

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