Simulation Best Practices For Chip-Package-System Design & Development

Presented by

Alex Moody, Antenna Application Engineer, PADT

About this talk

Printed circuit boards (PCBs), ICs and IC packages are used in almost all electronic products across all industries: automotive, A&D, consumer electronics, healthcare and energy. With electronics getting smaller, engineers need to design boards that are smaller than ever and incorporate all the required features. Accurate modeling and simulation of these components are key to reliable end products. Ansys signal integrity (SI) analysis products are essential for designing the high-speed serial channels, parallel buses and complete power delivery systems found in modern high-speed electronic devices. These integrated electromagnetics (EM) and circuit simulation tools predict EMI/EMC, power integrity and SI issues, resulting in optimized system performance prior to the build-and-test process. Join PADT's Antenna Application Engineer and chip-packaging expert, Alex Moody for an in-depth look at challenges facing engineers working in this industry, Ansys capabilities that can provide solutions, and examples of outputs expected after implementing simulation. This presentation will focus on the following areas: - Power Integrity - Signal Integrity - ESD - EMI/EMC - Thermal & Mechanical Integrity - And much more
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