Name: Emerging High-Speed Interconnects & Gen-Z Fabric
Start: 2019-11-13T19:00:00Z
End: 2019-11-13T19:56:37.000Z
Location: BrightTALK
Rating: 4.3

The Gen-Z Consortium is made up of leading computer industry companies dedicated to creating and commercializing a new data access technology. The consortium’s 12 initial members are AMD, ARM, Broadcom, Cray, Dell EMC, Hewlett Packard Enterprise, Huawei, IDT, Micron, Samsung, SK hynix, and Xilinx.

Webinar #2 in our 2021 Heterogeneous Computing Series

Evolution of Heterogeneous Compute Using Gen-Z Fabric

This webinar will examine the key Gen-Z components necessary for future heterogeneous computing network functionality.

Laying the Foundation: Gen-Z Components for Heterogeneous Computing Networks

Gen-Z Consortium President Kurtis Bowman will be providing an update on Gen-Z’s progress in 2020 and a look toward the future. Additional information coming soon.

Gen-Z State of the State 2020

Introduction to µDK building blocks and platform software development kits for Gen-Z enablement.

Platform Software Development Kit for Gen-Z Enablement

PECFF (PCIe® Enclosure Compatible Form Factor) was developed to optimize next-gen system design and to reduce solution cost and complexity. PECFF leverages PCIe CEM AIC mechanical infrastructure, while providing a path to 112 GT/s performance.  Samtec has developed a scalable PECFF emulation platform that simplifies SI testing of signals via Gen-Z Scalable Connectors and top-edge connectivity.  In this webinar, Samtec technical experts will summarize PECFF while demonstrating real world performance achievable in a PECFF system.

Real World Applications of PECFF for Increased Performance and Disaggregation

High speed serial data Interconnects require high levels of reliability and ensuring that links establish and are maintained at the desired data rates and widths relies on effective validation of the link initialization process. The Gen-Z specification allows the use of different physical layer standards, each with their own methods of initialization. This webinar will discuss common challenges seen during initialization of links using both PCI Express and 802.3 PHY layers and how a protocol analyzer can be an invaluable tool for debugging these critical stages of operation.

Ensuring Reliable High-Speed Gen-Z Link Initialization

Second in our series of technical webinars, member company Dell EMC's Greg Casey will discuss protocol abstraction of fabric attached endpoints and Gen-Z technology.

Protocol Based Abstraction of Fabric Attached Endpoints

Hear from Gen-Z Consortium PHY Workgroup representatives as they provide a technical overview of Gen-Z's Physical Layer specification. Participants in this presentation are:
-James Regan - Gen-Z PHY Workgroup Co-Chair and HPE Interconnect Expert
-Dr. Karl Bois - HPE Lead Signal Integrity and System Interconnect Engineer
-Tim Symons - Associate Technical Fellow at Microchip Technology

A Deep Dive Into PHY Architectures for Gen-Z Memory Fabrics

In a data centric world, security is key. Gen-Z’s built-in security measures addresses potential threats at the component level. In this webinar, Gen-Z Lead Architect Michael Krause will share how Gen-Z provides component and packet authentication, the foundation for a secured infrastructure using Gen-Z technology.

Gen-Z: Built-In Security for the Data Centric World

In this webinar, attendees will gain insight into Gen-Z technology applications and a deeper understanding of potential deployment options for their purposes. Attendees will learn how Gen-Z can help overcome current challenges within existing computer architecture and provide future opportunities for innovative, open, efficient, secure, and cost-effective solutions.

Understanding Gen-Z Technology: The Fabric of the New Data Center

Advancing modular and composable solutions in an open environment for data-centric, AI, and machine learning

Emerging High-Speed Interconnects & Gen-Z Fabric

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Emerging High-Speed Interconnects & Gen-Z Fabric

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