Hi [[ session.user.profile.firstName ]]

A Deep Dive Into PHY Architectures for Gen-Z Memory Fabrics

Hear from Gen-Z Consortium PHY Workgroup representatives as they provide a technical overview of Gen-Z's Physical Layer specification. Participants in this presentation are:
-James Regan - Gen-Z PHY Workgroup Co-Chair and HPE Interconnect Expert
-Dr. Karl Bois - HPE Lead Signal Integrity and System Interconnect Engineer
-Tim Symons - Associate Technical Fellow at Microchip Technology
Recorded Mar 25 2020 58 mins
Your place is confirmed,
we'll send you email reminders
Presented by
James Regan, HPE; Dr. Karl Bois, HPE; Tim Symons, Microchip
Presentation preview: A Deep Dive Into PHY Architectures for Gen-Z Memory Fabrics

Network with like-minded attendees

  • [[ session.user.profile.displayName ]]
    Add a photo
    • [[ session.user.profile.displayName ]]
    • [[ session.user.profile.jobTitle ]]
    • [[ session.user.profile.companyName ]]
    • [[ userProfileTemplateHelper.getLocation(session.user.profile) ]]
  • [[ card.displayName ]]
    • [[ card.displayName ]]
    • [[ card.jobTitle ]]
    • [[ card.companyName ]]
    • [[ userProfileTemplateHelper.getLocation(card) ]]
  • Channel
  • Channel profile
Webinars highlighting a solution for processing & analyzing data.
The Gen-Z Consortium is made up of leading computer industry companies dedicated to creating and commercializing a new data access technology. The consortium’s 12 initial members are AMD, ARM, Broadcom, Cray, Dell EMC, Hewlett Packard Enterprise, Huawei, IDT, Micron, Samsung, SK hynix, and Xilinx.

Embed in website or blog

Successfully added emails: 0
Remove all
  • Title: A Deep Dive Into PHY Architectures for Gen-Z Memory Fabrics
  • Live at: Mar 25 2020 5:00 pm
  • Presented by: James Regan, HPE; Dr. Karl Bois, HPE; Tim Symons, Microchip
  • From:
Your email has been sent.
or close