A Deep Dive Into PHY Architectures for Gen-Z Memory Fabrics

Presented by

James Regan, HPE; Dr. Karl Bois, HPE; Tim Symons, Microchip

About this talk

Hear from Gen-Z Consortium PHY Workgroup representatives as they provide a technical overview of Gen-Z's Physical Layer specification. Participants in this presentation are: -James Regan - Gen-Z PHY Workgroup Co-Chair and HPE Interconnect Expert -Dr. Karl Bois - HPE Lead Signal Integrity and System Interconnect Engineer -Tim Symons - Associate Technical Fellow at Microchip Technology

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The Gen-Z Consortium is made up of leading computer industry companies dedicated to creating and commercializing a new data access technology. The consortium’s 12 initial members are AMD, ARM, Broadcom, Cray, Dell EMC, Hewlett Packard Enterprise, Huawei, IDT, Micron, Samsung, SK hynix, and Xilinx.