Protocol Based Abstraction of Fabric Attached Endpoints
Second in our series of technical webinars, member company Dell EMC's Greg Casey will discuss protocol abstraction of fabric attached endpoints and Gen-Z technology.
RecordedMay 27 202046 mins
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Gen-Z Consortium President Kurtis Bowman will be providing an update on Gen-Z’s progress in 2020 and a look toward the future. Additional information coming soon.
Steve Krooswyk, Sr SI Engineer, Samtec / Ralph Page, Sr. System Architect, Samtec / Matt Burns, Technical Marketing Manager
PECFF (PCIe® Enclosure Compatible Form Factor) was developed to optimize next-gen system design and to reduce solution cost and complexity. PECFF leverages PCIe CEM AIC mechanical infrastructure, while providing a path to 112 GT/s performance. Samtec has developed a scalable PECFF emulation platform that simplifies SI testing of signals via Gen-Z Scalable Connectors and top-edge connectivity. In this webinar, Samtec technical experts will summarize PECFF while demonstrating real world performance achievable in a PECFF system.
High speed serial data Interconnects require high levels of reliability and ensuring that links establish and are maintained at the desired data rates and widths relies on effective validation of the link initialization process. The Gen-Z specification allows the use of different physical layer standards, each with their own methods of initialization. This webinar will discuss common challenges seen during initialization of links using both PCI Express and 802.3 PHY layers and how a protocol analyzer can be an invaluable tool for debugging these critical stages of operation.
Second in our series of technical webinars, member company Dell EMC's Greg Casey will discuss protocol abstraction of fabric attached endpoints and Gen-Z technology.
James Regan, HPE; Dr. Karl Bois, HPE; Tim Symons, Microchip
Hear from Gen-Z Consortium PHY Workgroup representatives as they provide a technical overview of Gen-Z's Physical Layer specification. Participants in this presentation are:
-James Regan - Gen-Z PHY Workgroup Co-Chair and HPE Interconnect Expert
-Dr. Karl Bois - HPE Lead Signal Integrity and System Interconnect Engineer
-Tim Symons - Associate Technical Fellow at Microchip Technology
Michael Krause, HPE VP/Fellow, Gen-Z Lead Architect
In a data centric world, security is key. Gen-Z’s built-in security measures addresses potential threats at the component level. In this webinar, Gen-Z Lead Architect Michael Krause will share how Gen-Z provides component and packet authentication, the foundation for a secured infrastructure using Gen-Z technology.
Valerie Padilla, Technology Strategist in the Server CTO, Dell EMC
In this webinar, attendees will gain insight into Gen-Z technology applications and a deeper understanding of potential deployment options for their purposes. Attendees will learn how Gen-Z can help overcome current challenges within existing computer architecture and provide future opportunities for innovative, open, efficient, secure, and cost-effective solutions.
Webinars highlighting a solution for processing & analyzing data.
The Gen-Z Consortium is made up of leading computer industry companies dedicated to creating and commercializing a new data access technology. The consortium’s 12 initial members are AMD, ARM, Broadcom, Cray, Dell EMC, Hewlett Packard Enterprise, Huawei, IDT, Micron, Samsung, SK hynix, and Xilinx.
Protocol Based Abstraction of Fabric Attached EndpointsGreg Casey, Engineer, Office of the CTO, Dell EMC[[ webcastStartDate * 1000 | amDateFormat: 'MMM D YYYY h:mm a' ]]46 mins