The Journey to CopprLink™ and Beyond: An Exploration of PCIe® Cabling Solutions

Presented by

Samuel Kocsis (Amphenol) and Mohiuddin Mazumder (Intel)

About this talk

As the need for PCI Express® (PCIe®) cabling has grown, PCI-SIG® has kept pace with the industry demand for high-speed cabling solutions in applications like disaggregated servers, data center networking, storage, AI, automotive and more. In May 2024, PCI-SIG released the CopprLink™ Internal and External specifications for PCIe 5.0 and 6.0 technology, providing internal and external cabling solutions at 32.0 and 64.0 GT/s. The release of the CopprLink Internal and External specifications is the latest step on a journey toward PCIe cabling solutions that meet evolving industry needs. By providing internal and external cables of varying speeds and reach that utilize existing connector form factors, PCI-SIG is ensuring the industry can choose the best PCIe cabling solution for their applications. Along with CopprLink Internal and External specifications, PCI-SIG is exploring an optical interconnect for data-demanding applications like AI, cloud computing and HPC. In this webinar, attendees will learn: • An overview of current PCI-SIG cabling efforts – past, present and future • The application space for PCIe cabling, including data center networking, AI, storage and more • The future of PCIe cabling as PCI-SIG explores an optical interconnect and PCIe 7.0 technology at 128 GT/s
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PCI-SIG is the organization that defines the PCI Express® (PCIe®) I/O bus specifications and related form factors. Our channel will feature quarterly webinars covering topics like PCIe specification overviews, PCI-SIG compliance and interoperability, PCIe form factors, PCIe applications and more. Our webinars will be presented by PCI-SIG technology experts from leading technology companies.