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CXL 3.0: Enabling composable systems with expanded fabric capabilities

Presented by

Dr. Debendra Das Sharma, CXL TTF Co-Chair and Intel Senior Fellow, and Danny Moore, CXL MWG Contributor, Rambus

About this talk

In August 2022, CXL Consortium released the CXL 3.0 specification. CXL 3.0 expands on previous technology generations to increase scalability and optimize system level flows with advanced switching and fabric capabilities, efficient peer-to-peer communications, and fine-grained resource sharing across multiple compute domains. It also doubles the data rate to 64 GT/s with no added latency over CXL 2.0, while maintaining backward compatibility with previous specifications. This webinar will introduce the CXL 3.0 specification and explore the new features including: • Fabric capabilities and management • Dynamically composable systems • Improved memory sharing and pooling • Enhanced coherency • Peer-to-peer communication • Doubled data rate with no added latency
CXL® Consortium

CXL® Consortium

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CXL® Consortium: Breakthrough CPU-to-Device Interconnect
Compute Express Link® (CXL®) is a new breakthrough high-speed CPU interconnect that enables a high-speed, efficient performance between the CPU and platform enhancements and workload accelerators. Industry leaders Alibaba, Cisco, Dell EMC, Facebook, Google, Hewlett Packard Enterprise, Huawei, Intel Corporation and Microsoft have teamed up to form an open industry standard group to develop technical specifications that facilitate breakthrough performance for emerging usage models while supporting an open ecosystem for data center accelerators and other high-speed enhancements.
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