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An Overview of the CXL 3.X Specification

Presented by

Mahesh Natu, Intel

About this talk

The CXL® 3.X specification was introduced to support AI and ML workloads for cloud and on-premise applications, providing advanced switching and fabrics capabilities for CXL devices, efficient peer-to-peer communications, and resource sharing across compute domains. CXL 3.2 builds upon these advancements for CXL memory devices, optimizing device management, functionality, and security to facilitate heterogeneous memory and computing solutions. This webinar will provide a brief overview of CXL 3.X, the benefits it brings to the industry, and introduce the new features in CXL 3.2, including: • Optimized CXL Memory Device Monitoring and Management • Enhanced functionality of CXL Memory Devices for OS and Application • Extended security with TSP (Trusted Security Protocol)
CXL® Consortium

CXL® Consortium

6448 subscribers21 talks
CXL® Consortium: Breakthrough CPU-to-Device Interconnect
Compute Express Link® (CXL®) is a new breakthrough high-speed CPU interconnect that enables a high-speed, efficient performance between the CPU and platform enhancements and workload accelerators. Industry leaders Alibaba, Cisco, Dell EMC, Facebook, Google, Hewlett Packard Enterprise, Huawei, Intel Corporation and Microsoft have teamed up to form an open industry standard group to develop technical specifications that facilitate breakthrough performance for emerging usage models while supporting an open ecosystem for data center accelerators and other high-speed enhancements.
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