Name: Prototype 5G FR2 with the AMD Zynq™ RFSoC DFE and mmWave Phased Array
Start: 2023-12-04T23:01:00Z
End: 2023-12-04T23:02:07.000Z
Location: BrightTALK
Rating: 4.7

With a century of success at our foundation, Avnet can guide you through our global technology ecosystem at any — or every — phase of your journey. Our experts support your innovation, turn your challenges into opportunities and build the right solutions for your success. Make your vision a reality and reach further with Avnet as your single trusted partner.

Green Technology is seeing massive growth due to environmental concerns and the availability of enabling technologies. From agriculture and energy to transportation and smart cities, the Internet of Things is paving the way for organizations and municipalities to embrace green practices.
Explore how to overcome these obstacles with the latest advancements in Silicon Carbide (SiC) and IGBT technologies. Designed for engineers and technical decision-makers, this session will provide actionable insights to help you integrate cutting-edge technology into your projects effectively.

What you’ll learn:
• The key differences between IGBT and SiC technologies and design considerations
• How to tackle common design challenges using onsemi’s comprehensive ecosystems, tools and modules
• The role of green technology in driving advancements in BESS technology

Accelerate Energy storage system designs with discrete & module power solutions

Are you facing challenges integrating and optimizing Battery Energy Storage Systems (BESS)? Join us to learn how Molex is addressing these challenges and more. Their innovative interconnect technology will help you create a sustainable and resilient energy future.

What you’ll learn:
• The role of low, medium and high voltage connectors in enhancing BESS performance
• Real-world insights from Molex’s experience in energy storage systems

Enhancing BESS Performance: Connector Solutions for Key Modules & Applications

Cable assembly selection is paramount when it comes to ensuring optimal performance, compatibility, and durability for specific applications - including autonomous mobile robots (AMRs) in warehouses and industrial environments.

AMRs incorporate numerous moving components that subject cable assemblies to mechanical stress, frequent flexing, and extreme conditions. In order to maintain a consistent and reliable flow of materials and products it’s crucial to keep these robots and their parts in peak shape.

In this webcast, you will discover tailor-made cable assembly services that support power and signal needs, RF cable assemblies, and Flexible Printed Circuits, designed from inception to production. Tune in now to learn about:

• Weight and space considerations
• How Molex connectors are engineered for durability
• Reducing downtime and enabling uninterrupted operation
• And much more

Why cable assembly selection is crucial for autonomous mobile robots

The global autonomous mobile robot (AMR) market is set to grow significantly over the next decade, impacting industries like healthcare, automotive, logistics, hospitality, and more.

However, this growth would not be possible without recent advancements in vision and AI. Using these key technologies, AMRs scan surroundings and communicate status to ensure warehouses and industrial environments running efficiently and reliably.

In this webcast, you’ll gain expert insights into vision and AI-embedded processing devices for AMR design. You’ll also find use cases and techniques to overcome challenges in autonomous robotics using hardware and software solutions from Renesas. Tune in now to learn about design methodologies that help system designers build better prototypes and speed up time-to-market.

Upgrade your autonomous mobile robot designs with vision & AI technologies

The AMD Kria™ K24 System-on-Module (SOM) is engineered to streamline and expedite the development of compact, energy-efficient, and cost-sensitive industrial edge applications. These applications encompass a wide array of uses, including electric drives and motor control, along with other digital signal processing-intensive tasks.

Learn how AMD is providing comprehensive support for the the Kria™ K24 through the KD240 Drives Starter Kit, optional motor accessory pack, the Kria App Store and support for Python as well as MATLAB and Simulink. This kit will have engineers up and running quickly for 1-to-n axes of control.

This webinar will cover:
• The pivotal role of high-performance digital signal processing (DSP) in controlling cutting-edge Silicon Carbide and Gallium Nitride power electronics, showcasing the reductions in power consumption.
• Importance of ECC-protected memory, hardware root-of-trust in high-reliability systems
• Scalability of the Kria SOM portfolio to support connector compatibility between the complementary K24 and K26 SOMs
• Support for hardware, software, and control system engineers, AI scientists and roboticists with Kria SOM-supported development flows
• Features of the KD240 Drives Starter Kit and the two optional motor accessories

The Kria K24 SOM lowers the barrier of entry for developers to leverage power-efficient DSP and high compute density for motor drive applications where low latency, determinism and reliability are essential. Learn how AMD is bringing support to the Industrial Internet of Things (IIoT) with the Kria K24 family.

Designing a Power-Efficient Future with the New, Scalable AMD Kria™ K24

Join us for a Space webinar based on the AMD XQR Versal devices and the supporting ecosystem. This presentation provides an overview of the features of the XQR Versal devices, with an update on radiation data for the 7nm Versal in proton environments. We will cover the latest qualification results and describe the ecosystem of solutions. These radiation-tolerant devices provide increased processing bandwidth for emerging space programs. Discover how the Renesas Power Solutions and the Teledyne Memory and RF products provide a complete ecosystem for development.

What you'll learn:
- Overview of the 7nm XQR Versal device features
- Renesas core voltage rail and complete power supply reference design
- Introduction to Teledyne’s space-grade DDR4 memory and e2v microwave data converters

Speakers
Ken O'Neill, Space Systems Architect, AMD
Ken O'Neill recently joined AMD as Space Systems Architect with responsibility for AMD's participation in the space market, including the Xilinx XQR radiation tolerant and space-qualified FPGA product line. Ken has 20 years of experience in the field of radiation-tolerant FPGAs and space electronics, and a total of 30 years experience in the FPGA industry.

Kiran Bernard, Technical Product Marketing, Renesas
Kiran Bernard is responsible for the roadmap development in Renesas’ Radiation Hardened Communications product line for the Intersil family of power management products. He has supported the space and high-reliability markets for 13 years.

Nicolas Chantier, Marketing Director, Teledyne e2v
Nicolas Chantier is Marketing Director at Teledyne e2v having worked there for 15 years. Nicolas heads up the marketing team for its Data & Signal Processing Solutions division.

Carolyn O’Connor, Director of Defense/Aerospace, Avnet
Carolyn O’Connor has been a contributor in the defense/aerospace field for many years prior to joining Avnet. Carolyn has been with Avnet for 17 years with a focus on Defense and Aerospace.

AMD’s Products and Partners Enable Space Applications

Matter has been a popular topic for both makers and professionals. There have been a number of
questions about how it works and why it was created. Join our experts for this on-demand webinar
where we’ll discuss the benefits of Matter and how it simplifies device integration.

Topics covered:
- What is Matter, and why was it created?
- How does Matter work?
- What tools and resources do you need to build your own Matter devices?
- What are some best practices for designing and testing Matter devices?
- What are the potential use cases for custom-built Matter devices?

On-Demand Nordic Webinar: Mastering Matter: Simplifying Smart Home Integration

Today's industry standard for distributing embedded Linux BSPs for i.MX applications processors is Yocto. This is a framework that allows developers to create a custom image. Yocto is a platform with great flexibility, but it comes with a steep learning curve for engineers.
Yocto works in a layered approach. Each layer groups a bunch of recipes, which are metadata, that instructs its build system where to fetch and how to configure and compile a package for a given machine.  It is typical to start with a working BSP on a reference platform and then add new layers with software as needed. This new layer can be application specific or incorporated from another provider.  This training will provide an introductory level demonstration of how the attendee can incorporate a demo application into a BSP using a Yocto layer approach.

Customizing your i.MX8 Yocto BSP

Attendees will be guided through the process of building a TensorFlow Lite object recognition embedded application.

Step-by-step instructions are provided based on the following software tools and hardware:
· NXP MCUXpresso IDE and MCUXpresso RT1170-EVK SDK
· NXP MCU-LINK debug cable
· Avnet MaaXBoard RT development board
· Avnet MaaXBoard MIPI-CSI camera (required)
· Avnet MaaXBoard 7-inch MIPI display (optional)

MaaXBoard RT: Implement TensorFlow Lite object recognition

Explore AWS and Azure’s respective technology stacks for the edge and how AMD-Xilinx's partnership provides solutions that help customers jumpstart their industrial internet of things (IIoT) designs. The session will showcase the Kria SoM product line and Zynq MPSoC technology, as well as XY Sense, a privacy-preserving sensor that delivers real time data for companies to future proof the way they plan and manage their office space.

What you’ll learn: 
o How AMD-Xilinx solutions integrate with AWS and Azure
o About Kria SoM and Zynq MPSoC technology
o Why XY Sense utilizes AMD-Xilinx products

Accelerated edge & cloud applications with AWS and Azure

Infineon’s Automotive division focuses on safety, which allows us to address all safety-relevant applications. In this webinar, we will look at trends in the industry and how this affects our product design. We will describe how to manage targeted safety use cases for different classes of Infineon products, through our Infineon PRO-SIL™ categories. 

What you’ll learn:
o How safety compliant products meet top level safety requirements
o How Infineon addresses different market trends through product safety
o A clear understanding of Infineon’s tiered approach to PRO-SIL™ classifications

Infineon supports dependable systems with safe semiconductors

We will explore options for building a safety case for systematic faults and random faults, in respect to the addition of DRAM and non-volatile memory to Micron’s safety roadmap. We will then describe our failure modes, effects and diagnostic analysis (FMEDA) approach for random fault mitigation, explain how DRAM can fail and which top-level failure modes (TLFM) are visible from host side. We will outline the issues with standard JEDEC DRAM and how Micron’s safety mechanisms help reach the hardware KPIs required for each ASIL level. Lastly, we will discuss the importance of system-level availability and traditional trade-offs associated with safety.

What you’ll learn: 
o The fundamentals of safety, including: ISO26262 standard, systematic vs. random fault coverage, top-level safety requirements, concepts of classification and detection
o The arguments for automotive-qualified safety-compliant memories and storage
o About Micron’s automotive-qualified ASIL compliant safety solutions portfolio and associated features

ASIL-D compliant memory in the design of next-gen ADAS systems

What is the cost of a robot falling down the stairs, a drone crashing into trees or a vehicle injuring humans? Today’s transition from the automated towards the autonomous requires robots to have extensive and reliable information about their surroundings. Autonomous systems can gather this information using numerous methods which enable the functional safety of UAVs, AGVs, robots and self-driving cars. One method is to use sensor technology based on the time-of-flight (ToF) method.

This webinar will give you an overview of ToF principles, including direct and indirect ToF. In addition, it will explore practical use cases and examples showing techniques to overcome today’s challenges in autonomous robotics using Broadcom’s solutions for direct and indirect ToF applications.

You will learn about:
o Time-of-flight (ToF) principles
o Applications & use cases
o Challenges & solutions

Time-of-flight: Fundamentals and solutions for autonomous robotics

Horticultural LED lighting in its varying forms — greenhouse farming, vertical farming, urban farming —must address the ever-increasing urban population need for food while also addressing the expanded production of legalized cannabis for medicinal and recreational purposes. 

What you’ll learn: 
o Norms in photobiological affects, wiring and connection methods
o Environmental considerations, ingress protection and UV of polymetric materials
o How interconnection solutions reduce luminaire design process, installation and cost

Cable and Connector Design for Horticultural Lighting

Natural sunlight has proven to be the most beneficial to human and plant development throughout history. SunLike LEDs are a reality that can enable these benefits across different indoor spaces with proven health, productivity and horticulture benefits.  

Learning points:
o The effect of daylight LEDs on visual comfort, melatonin, productivity and sleep
o	Trends in horticulture lighting aligning with the solar spectrum
o	How LEDs can mimic the solar spectrum to enhance performance

Broad Spectrum Emitter Applications Using SunLike Technology

This webinar introduces an integrated 5G FR2 phased array antenna-to-bits development system.

Engineers from AMD and Avnet describe this new platform, featuring the AMD Zynq™ RFSoC DFE with multi-channel direct-RF data converters and hardened IP, 5G NR signal generation in MATLAB®, and beamforming through the Fujikura FutureAccess™ mmWave phased array antenna module. To prove this is not “science fiction”, we are joined by test experts from Rohde & Schwarz to demonstrate automated OTA measurements using their R&S®ATS800B CATR benchtop antenna test system.



AMD, and the AMD Arrow logo, UltraScale+, Zynq, and combinations thereof are trademarks of Advanced Micro Devices, Inc.

Prototype 5G FR2 with the AMD Zynq™ RFSoC DFE and mmWave Phased Array

avnet

RF Data Converter

OTA Measurements

Data Converters

Development

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Prototype 5G FR2 with the AMD Zynq™ RFSoC DFE and mmWave Phased Array

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Avnet, Inc.