Enabling next-generation SoC on Samsung Foundry with PCIe 5.0/6

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Presented by

Stephane Hauradou, Product Marketing

About this talk

Exponential data growth is driving the need for increased performance in Enterprise and Data Center applications, and resulted in the emergence of new interconnect technologies such as CXL and CCIX, and faster transition to PCIe 5.0 and PCIe 6.0. This presentation looks at the different protocol technologies and introduces PLDA and Alphawave joint Controller and PHY IP solution for the Samsung Advanced Process Nodes. We describe the joint solution in terms of features and capabilities, and present the stringent verification and validation methodology in place to guarantee first-pass silicon success for Samsung Foundry customers.

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Rambus makes industry-leading chips and IP that advance data center connectivity and solve the bottleneck between memory and processing. The ongoing shift to the cloud, along with the widespread advancement of AI across data center, 5G, automotive and IoT, has led to an exponential growth in data usage and tremendous demands on data infrastructure. Creating fast and safe connections, both in and across systems, remains one of the most mission-critical design challenges limiting performance in advanced hardware. Rambus is ideally positioned to address this challenge as an industry pioneer with over 30 years of advanced semiconductor interconnect experience moving and protecting data. We are a leader in high-performance memory subsystems, providing chips, IP and innovations that maximize the performance and security in data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data transfer speed and trust. Rambus products and innovations deliver the increased bandwidth, capacity and security required to usher in a new era of data center architectures and drive ever-greater end-user experiences.