Preparing for PCIe 6.0

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Presented by

Stephane Hauradou, Product Marketing (PLDA) - Gordon Allan, Product Manager for Verification IP (Siemens EDA)

About this talk

As the need for data has exploded driven by applications like AI/ML and automotive, the semiconductor industry, led by PCI-SIG, is preparing for the final release of the PCIe 6.0 specification and all the changes it entails. In this first of two joint webinars, PLDA and Siemens EDA join to introduce you to PCIe 6.0, including architecture differences from prior generations, performance improvements, and how PCIe 6.0 compares from both a designer and verification perspective. What you will learn: - what is PCIE 6.0 - how does it differ from past generations - design considerations when planning with PCIe 6 - verification implications of a PCIe 6 design

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Rambus makes industry-leading chips and IP that advance data center connectivity and solve the bottleneck between memory and processing. The ongoing shift to the cloud, along with the widespread advancement of AI across data center, 5G, automotive and IoT, has led to an exponential growth in data usage and tremendous demands on data infrastructure. Creating fast and safe connections, both in and across systems, remains one of the most mission-critical design challenges limiting performance in advanced hardware. Rambus is ideally positioned to address this challenge as an industry pioneer with over 30 years of advanced semiconductor interconnect experience moving and protecting data. We are a leader in high-performance memory subsystems, providing chips, IP and innovations that maximize the performance and security in data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data transfer speed and trust. Rambus products and innovations deliver the increased bandwidth, capacity and security required to usher in a new era of data center architectures and drive ever-greater end-user experiences.